Offer high-frequency coax contact density in a rugged modular package for reliable RF performance in harsh environments
By Alex Pluemer, contributing writer
TE Connectivity recently unveiled a new series of NanoRF modules and contacts that the company claims provide twice the density of standard VITA 67 RF modules for VPX embedded computing applications. The nanominiature coax contact design enables smaller packaging and saves space by using smaller contacts and a higher RF contact density in a multi-position module.
Full-sized modules can support 18 RF contacts or higher, while half-sized modules can support up to 12 RF contacts. Customers have the option to customize contact count and position.
The NanoRF modules feature blind-mateable, float-mounted backplane contacts that support box-to-box or module-to-module architecture. They also offer a floating insert on the backplane side with guide features to pre-align the contact array before they engage, which ensures reliable mating and consistent RF performance for up to 500 mating cycles, said the company.
“NanoRF offers outstanding high frequency coax contact density in a rugged modular package, which is ideal for providing reliable RF performance in harsh environments,” according to Mike Walmsley, global product manager for TE’s Aerospace, Defense and Marine division. “It has been tested to VITA 72’s high vibration standards and is ready for VPX open architecture under VITA 67.3 — with a roadmap for expansion into other high-density packages.”
TE’s Nano RF modules are designed to support 0.047-inch coax cable but can implement a variety of other cable types per application requirements. All contacts are optimized for signal integrity and support frequencies of up to 70 GHz.
NanoRF modules can be purchased from the TE store.