KEMET using KONNEKT packaging for KC-LINK range

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KEMET has extended its KC-LINK range by using KONNEKT high-density packaging technology to meet demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. This technology combines KC-LINK’s C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip …

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