Surface Mount Capacitors For High-Density Power Applications By KEMET

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The company’s high-density packaging technology enables creation of a surface mount chip for both high-density packaging and high-efficiency applications Delivers thermal stability and mechanical robustness with low-loss KEMET has further strengthened its power conversion solutions by extending its KC-LINK range using KONNEKT high-density packaging technology for meeting the growing demands of fast-switching wide bandgap (WBG) […]

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