Dialog Semiconductor and TDK have claimed the smallest PoL DC/DC converter, leveraging their highly integrated GreenPAK and µPOL technologies, respectively
By Gina Roos, editor-in-chief
A collaboration between Dialog Semiconductor plc and TDK Corp. has yielded the industry’s smallest point of load (PoL) DC/DC converter. By leveraging Dialog’s GreenPAK technology and TDK’s latest series of µPOL power solutions, the companies have claimed the first single-integrated system power sequencing solution that enables miniaturization and higher power density. This new solution is suitable for advanced industrial embedded control, IoT, and 5G applications.
By combining the highly integrated GreenPAK technology with the high-density power module technology, the power sequencing solution reduces the number of requirement components, which saves board space, reduces overall manufacturing cost, and improves system reliability. In addition, the GreenPAK technology reduces production lead time to four to six weeks, expediting the development of complex system boards.
The µPOL solution also delivers additional benefits by leveraging advanced technology packaging techniques such as semiconductor embedded in substrate (SESUB) for 3D system integration in a smaller size and lower profile, resulting in higher power density and a lower total system cost. As an example, TDK’s FS1406 6-A power module can deliver 15 watts in a 3.3 x 3.3 x 1.5-mm height power module, which is four times higher current density than the closest competitor, according to the company.
The FS1406, FS1403, and FS1404 modules are available at all major distributors, including Arrow, Avnet, Digi-Key, Farnell, Future, Mouser, and TTI.