SANTA CLARA, Calif., Aug. 07, 2020 (GLOBE NEWSWIRE) — Applied Materials, Inc. today announced a new addition to its highly successful Centris® Sym3® etch product family that now enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips.
https://ecntoday.com/wp-content/uploads/2019/11/logo-fb.png 960 960 admin https://ecntoday.com/wp-content/uploads/2019/11/logo-300x138.png admin2020-08-07 11:30:002020-08-07 12:26:01Applied Materials Introduces New Sym3® Etch System for Advanced Memory and Logic Chips
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