Applied Materials and BE Semiconductor Industries to Accelerate Chip Integration Technology for the Semiconductor Industry

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Companies Form Joint Program to Develop Industry’s First Complete and Proven Equipment Solution for Die-Based Hybrid Bonding

Companies Form Joint Program to Develop Industry’s First Complete and Proven Equipment Solution for Die-Based Hybrid Bonding

Article from: http://www.globenewswire.com/news-release/2020/10/22/2112437/0/en/Applied-Materials-and-BE-Semiconductor-Industries-to-Accelerate-Chip-Integration-Technology-for-the-Semiconductor-Industry.html