NXP Extends its Leadership in 5G Infrastructure with 2ⁿᵈ Generation RF Multi-Chip Modules That Amp Up Frequency, Power and Efficiency
EINDHOVEN, The Netherlands, Dec. 02, 2020 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of its 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements for cellular base stations. Focused on accelerating the coverage of 5G, the new all-in-one power amplifier module family is based on NXP’s latest LDMOS technology that offers higher output power, extended frequency coverage, and higher efficiency—all within the same footprint as NXP’s previous generation of MCMs.