Infineon launches next-generation XENSIV MEMS microphone

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Infineon Technologies AG’s has released its next-generation analog MEMS microphone, the XENSIV MEMS microphone IM73A135, offering improvements offer previous generation devices. The company claims the latest microphone solves some of the biggest trade-offs associated with these devices versus electret condenser microphones (ECM) in areas such as dynamic range, size, and power consumption.

The IM73A135, measuring 4 x 3 x 1.2 mm, offers a 73 dB SNR and a high acoustic overload point (135 dB SPL), which results in a high dynamic range microphone. Other features include a tight frequency curve matching for audio signal processing and the industry’s lowest power consumption of 170 μA, according to Infineon.

Comparison of the acoustic performance to previous generations of MEMS mics (Image: Infineon)

Infineon IM73A135 MEMS microphoneThe IM73A135 enables designers to reach a level of high audio performance previously restricted to ECMs, while leveraging the inherent benefits of MEMS technology, said Infineon. The low self-noise makes the IM73A135 suited for active noise cancellation in headphones and high-quality audio capturing required in conference systems, cameras, or audio recorders.

At the same time, Infineon plans to extend its new low-power digital ASIC technology in a variety of next-generation digital microphones manufactured and branded by the “Infineon-inside” microphone partner network. The low-power-mode current consumption of as little as 110 µA makes it suitable for wearables, including smartwatches and fitness bands.

The IM73A135 XENSIV MEMS microphone will be available in the distribution channel in March 2021. The new MEMS microphone technology for wearables will be launched by the “Infineon-inside” partners in the next months. For more information, visit Infineon’s digital showcase at CES 2021.

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